Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.
1～29 item / All 29 items
Ultrasonic flip chip bonder
A compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. It can accommodate a wide range of applications from mass production for various products to process and material development.
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
The "FALCON Series" is a die flip chip die bonder that offers a lineup of devices tailored to user needs, ranging from manual to automatic specifications. We can manufacture die flip chip bonders according to your company's required specifications by combining various options. We can propose devices suitable for your specifications, including heating mechanisms, high-load bonding, wafer pickup, and chip flipping functions. Additionally, there are higher models that can accommodate fully automatic specifications with attachments like conveyors, and since these are our own products, we can flexibly respond to your desired customization specifications. 【Features】 ■ Operability Achieves smooth XY stage operability using a joystick. Basic operations can be completed easily with the joystick, providing simple operation specifications. ■ Load Control Supports applications requiring advanced load control through program operation by a motor (Z-axis resolution in micrometers) and VCM control (optional). ■ Software User interface design that does not require a manual. User-friendly specifications that allow for easy setting of bonding parameters and recognition program creation. *For more details, please download the PDF materials.
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
It enables bonding control at low loads compared to conventional flip chip bonding, significantly reducing load and stress damage to bumps, aluminum pads, wiring, and more. The thermal shrinkage compensation function during cooling prevents failures such as cracks and disconnections, achieving a high-yield, highly reliable bonding process. Moreover, it is an innovative system capable of achieving bonding with high precision of ±1μm at 3σ.
Manual flip chip bonder suitable for small-scale production and various experiments.
The "CB-505" supports various packages (*1) and various bonding processes (*2) due to its highly versatile device concept. *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, ultrasonic, etc. *For more details, please refer to the PDF materials or feel free to contact us.
Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.
The FA700 ultrasonic high-precision flip chip bonder enables the development of advanced semiconductor packaging technologies, such as three-dimensional semiconductors, through the ultrasonic bonding process. It allows for high-precision alignment with an IR transmission optical system and is equipped with high-precision positioning functions, including infrared optical systems. 【Features】 ○ High-precision positioning function ○ High-quality bonding ○ Detailed bonding condition settings For more information, please contact us or download the catalog.
Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.
The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.
Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.
The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.
Achieved alignment accuracy of ±0.2μm. Extensive track record of implementation, primarily in optical communication and silicon photonics.
The "NANO Pro" is a bonding device that uses ASMPT's patented alignment technology to bond diced chips to wafers, substrates, and chips with ultra-high precision of ±0.2μm. It employs laser bonding, achieving localized heating and a high-speed temperature profile during the bonding process. It also features mechanisms to suppress vibrations during bonding and from external sources. 【Main Specifications】 ■ Alignment Accuracy: ±0.2μm@3σ ■ Cycle Time: 18 seconds (varies by material) ■ Die Size: 0.1mm to 25mm ■ Substrate Size: MAX 300×300mm ■ Bonding Force (Load): 3g up to 2000g ■ Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding 【Adoption Results】 ■ Optical communication ■ Silicon photonics ■ R&D and mass production facilities ■ MEMS sensors, LiDAR, VCSELs, etc. *For more details, please feel free to contact us.
The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.
This machine is a high-precision semi-automatic flip chip bonder suitable for experiments, development, and small-scale production. With a digitally adjustable pulse heat stage and various options, it can handle a wide range of assembly processes with just this one unit.
It is a high-precision die bonder optimized for mass production of optical devices. Additionally, we also offer the highly precise FDB210P in our lineup.
This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip and mounting. There are two types: the FDB210 model, which supplies chips and substrates via trays, and the FDB211 model, which supplies with grip rings.
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
Full automation is possible at a low cost through integration with the conveying system.
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
● This is a compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. ● Achieves high precision at a low cost! It can be upgraded to a fully automated system for mass production with our automatic substrate transport system. ● It can accommodate a wide range of applications from multi-variety production for cell manufacturing to process and material development.
High-performance flip chip bonder for multi-variety cell production lines.
By exchanging the head, it is possible to accommodate a wide range from thermal pressing methods to ultrasonic-assisted thermal pressing methods.
LED flip chip mounting device
- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
"NANO" is a device that enables bonding of ultra-high precision diced chips to wafers/substrates/chips using the company's patented alignment technology. It also features a unique laser irradiation method during bonding and is equipped with a mechanism to suppress vibrations during the bonding process. 【Features】 - Alignment accuracy: ±0.3µ@3σ - Alignment technology (patented) - Bonding method during bonding - Equipped with vibration suppression mechanism - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications of the Device】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Bonding methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported.
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
"Nova plus" is a device that enables bonding of high-speed diced chips to wafers/substrates/dies using the company's patented alignment technology. It is also equipped with a dual bond head. 【Features】 - Alignment accuracy: ±2.5μm @ 3σ - Alignment technology (patented) - Joining methods during bonding - Equipped with dual bond head - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±2.5μm @ 3σ - Cycle time: 1.5 to 6 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 600 x 600 mm - Bonding force (load): 10g to 5kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported - Option: For upgrade kit specifications, accuracy ±1.5 µm @ 3σ
High-precision bonding machine with ±5μm accuracy
The chips are pushed up from the wafer (tray) and adhered, followed by alignment through image processing after flipping them upside down. Automatic flip chip bonding is performed using thermal compression/adhesive (dispensing)/eutectic methods. The alignment accuracy is ±5 microns (under no load).
Flip Chip Bonder for IC Cards
Supports everything from user-friendly standalone types to inline systems.
